Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
Litlhaloso tsa kopano ea PCBA/PCB:
1. PCB layers: 1 ho isa ho 36 layers (standard)
2. Lisebelisoa / mefuta ea PCB: FR4, aluminium, CEM 1, PCB e tšesaane haholo, FPC / monoana oa khauta, HDI
3. Mefuta ea litšebeletso tsa kopano: DIP/SMT kapa SMT e tsoakiloeng le DIP
4. Botenya ba koporo: 0.5-10oz
5. Qetello ea bokaholimo: HASL, ENIG, OSP, tin ea ho qoelisoa, Ag ea ho qoelisoa, khauta e khanyang
6. PCB litekanyo: 450x1500mm
7. IC pitch (min): 0.2mm
8. Boholo ba chip (min): 0201
9. Sebaka sa leoto (min): 0.3mm
10. BGA boholo: 8×6/55x55mm
11. SMT e sebetsang hantle: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
12. bophara ba bolo ea u-BGA: 0.2mm
13. Litokomane tse hlokahalang bakeng sa faele ea PCBA Gerber e nang le lenane la BOM le faele ea pick-n-place (XYRS)
14. SMT speed chip likarolo SMT speed 0.3S/piece, max speed 0.16S/piece