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PCBA bakeng sa tlhahiso ea kutlo
| Boema-kepe ba FOB | China (Naheng) |
| Lead time | 7-15 matsatsi |
- Kopano ea SMT
- 2 e beha mochini oa SMT o lebelo haholo
- 2 e beha lihatisi tse itirisang tse nang le khokahano ea fiduciary
- 2 e beha mechini ea tlhahlobo ea ICT
- Kopano ea THT
- Li-sete tse 2 tsa mela ea mochini oa wave soldering
- Sete e le 'ngoe ea motsoako o ikemetseng oa motsoako: IST-4000
- ISO 9001:2008
- Setifikeiti sa UL
- IPC-610D/E, ho latela melao ea sehlopha sa II
- ICT, AOI, tlhahlobo ea ts'ebetso
- Taolo ea thepa tlas'a tsamaiso ea ERP
- 1) Kopano ea SMT ho kenyelletsa kopano ea BGA
- 2) Li-chips tse amoheloang tsa SMD: 01005, BGA, QFP, QFN, TSOP
- 3) Karolo ea bophahamo: 0.2-25mm
- 4) Ho paka metsotso: 0201
- 5) Min sebaka har'a BGA: 0.25-2.0mm
- 6) Min BGA boholo: 0.1-0.63mm
- 7) Min QFP sebaka: 0.35mm
- 8) Min kopano boholo: (X) 50 * (Y) 30mm
- 9)Max kopano boholo: (X): 350 * (Y) 550mm
- 10) Ho nepahala ha ho beoa: ± 0.01mm
- 11) Bokhoni ba ho beha: 0805, 0603, 0402, 0201
- 12) High-pin count press fit e fumaneha
- 13) Bokhoni ba SMT ka letsatsi: lintlha tse 800,000
- 1) Boikarabello bo tiileng ba sehlahisoa, ho nka maemo a IPC-A-160
- 2) Boenjiniere ba pelehi pele ho tlhahiso
- 3) Taolo ea tšebetso ea tlhahiso (5ms)
- 4) Teko ea 100% ea E-teko, tlhahlobo ea pono ea 100%, ho kenyeletsoa IQC, IPQC, FQC, OQC
- 5) 100% tlhahlobo ea AOI, ho kenyeletsoa X-ray, microscope ea 3D le ICT
- 6) Teko ea matla a phahameng, teko ea taolo ea impedance
- 7) Microsection, bokhoni ba soldering, teko ea khatello ea mocheso, teko e tšosang
- 8) Tlhahiso ea PCB ka tlung
- 9) Ha ho palo e fokolang ea taelo le sampole ea mahala
- 10) Tsepamisa maikutlo ho tlhahiso ea molumo o tlase ho isa bohareng
- 11) Ho tsamaisoa ka potlako le ka nako
- - Asia
- - Australasia
- - Amerika Bohareng / Boroa
- - Europe Bochabela
- - Middle East/Africa
- - Amerika e leboea
- - Europe Bophirimela
Ngola molaetsa wa hao mona mme o re romele wona
