Tlhahiso ea PCB
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OEM PCBA Clone Assembly Service Tse ling PCB & PCBA Custom Electronics PCB Circuit Board
Kopo: Aerospace, BMS, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Letlapa la 'Mè, Smart electronics, ho tjhaja Wireless
Tšobotsi: Fexible PCB, High density PCB
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
lintho tse bonahalang: Aluminium e Koaheletsoeng ka Koporo Lera, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
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Customizable indasteri sehlopha taolo phanele
Indasteri-grade motherboard PCBA e hloka ho ba le tshebetso e babatsehang le botsitso 'me e loketse liindasteri tse sa tšoaneng, liroboto, lisebelisoa tsa bongaka le lisebelisoa tse ling.Khokahano ea eona e tšepahalang haholo le moralo oa moralo o netefatsa hore board ea mama e ke ke ea sebetsa hampe nakong ea ts'ebetso ea nako e telele, ho ntlafatsa ts'ebetso ka kakaretso le bophelo ba ts'ebeletso ea sesebelisoa.
Ho phaella moo, motherboard PCBA e na le sebeletsana e ntle le scalability, e lumella ho hokela le ho atolosa le peripherals tse fapa-fapaneng le lisensara ho kopana le litlhoko tsa maemo a fapaneng a kopo.Ka nako e ts'oanang, lisebelisoa tsa eona tse bonolo tsa tlhokomelo le ntlafatso li fokotsa litšenyehelo tsa tšebeliso le mathata a tlhokomelo.
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Sesole sa sefofane pcb E inehetseng e hatisitsoeng liboto potoloho etselitsoeng dikopo tsa sesole aerospace
1. Kopo: UAV (khatello e kopaneng ea maqhubu a phahameng)
Palo ea mekato: 4
Botenya ba poleiti: 0.8mm
Bolelele ba mola oa bophara: 2.5/2.5mil
Phekolo ea holim'a metsi: Tin
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Thepa ea bongaka PCB Medical electronics
1.Application: electrocardiogram detector
Palo ea mekato: 8
Botenya ba poleiti: 1.2mm
Bolelele ba mola oa bophara: 3/3mil
Phekolo ea bokaholimo: Khauta e tebileng
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Mojule oa puisano o bohlale PCB Liboto tsa potoloho tse hatisitsoeng tse etselitsoeng li-module tsa puisano tse bohlale tse sebelisoang lits'ebetsong tse fapaneng joalo ka Marang-rang a Lintho (IoT), puisano e se nang mohala le phetiso ea data.
1.Kopo: terminal e bohlale ea mohala
Palo ea lihlopha: Likarolo tse 12 tsa boto ea 3 ea HDI
Botenya ba poleiti: 0.8mm
Bolelele ba mola oa bophara: 2/2mil
Phekolo ea sefahleho: khauta + OSP
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Automotive electronics PCB Hangata e sebelisoa tsamaisong ea boithabiso ea likoloi, tsamaiso ea ho tsamaea, mekhoa ea tšireletso, tsamaiso ea taolo
1.Kopo: Boto ea lebone la likoloi (aluminium base)
Palo ea mekato: 2
Botenya ba poleiti: 1.2mm
Sekhahla sa mola oa bophara ba mela: /
Phekolo ea holim'a metsi: Fafatsa thini
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5G puisano PCB Liboto tsa potoloho tse hatisitsoeng tse sebelisoang lipuisanong tsa 5G
1.Applications: Solid state drives
Palo ea mekhahlelo: 12 layers (flexible 2 layers)
Bonyane aperture: 0.2mm
Botenya ba poleiti: 1.6±0.16 limilimithara
Bolelele ba mola oa bophara: 3.5/4.5mil
Phekolo ea bokaholimo: khauta ea nickel e tebisitsoeng
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PCB ea matla a macha Liboto tsa potoloho tse hatisitsoeng tse sebelisoang likoloing tsa letsatsi, moea le motlakase
1.Kopo: libeteri tse ncha tsa koloi ea matla
Botenya ba koporo: 2oz
Botenya ba poleiti: 2mm
Bolelele ba mola oa bophara: 6/6mil
Qetella: Khauta e tekiloeng
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PCB Manufacturing Indasteri taolo tshireletso
Kopo: Limithara tse bohlale
Nomoro ea mohlala: M02R04117
Plate: Ultrasonic GW1500
Botenya ba poleiti: 1.6+/-0.14mm
Boholo: 131mm * 137mm
Bonyane aperture: 0.4mm
