Litšobotsi tsa bohlokoa
Litšobotsi tse ling
Nomoro ea Mohlala: CKS-E ikemiselitsoeng
Mofuta: pcba ea sesebelisoa sa lapeng
Sebaka sa Tšimoloho: Guangdong, China
Lebitso la Brand: CKS
Boto e ncha ea taolo ea matla e na le litšobotsi tsa ho kopanya ho phahameng, ho laola ka bohlale, mesebetsi ea tšireletso, mesebetsi ea puisano, ho boloka matla le ho sireletsa tikoloho, ho tšepahala ho phahameng, tšireletso e matla le tlhokomelo e bonolo. Ke karolo ea bohlokoa ea lisebelisoa tse ncha tsa matla. Litlhoko tsa eona tsa ts'ebetso li kenyelletsa ho hanyetsa motlakase, ho hanyetsa hona joale, ho hanyetsa mocheso, ho hanyetsa mongobo, ho hanyetsa kutu, ho tšoarella le litšobotsi tse ling ho netefatsa botsitso le ho tšepahala ha lisebelisoa. Ka nako e ts'oanang, mapolanka a macha a ho laola matla a boetse a hloka ho ba le bokhoni bo botle ba ho thibela ho kena-kenana.
E sebelisoa haholo ho matla a tsosolositsoeng, likoloi tsa motlakase, li-grids tse bohlale le masimo a mang. Ke e 'ngoe ea mahlale a bohlokoa ho fihlela tšebeliso e nepahetseng ea matla a macha le paballo ea matla le phokotso ea mosi ho sebetsana le maemo a thata a ts'ebetso.
Kopo: Sesebelisoa sa elektroniki, Oem elektroniki, Telecommunication
Mofuta oa Bafani: Feme, Moetsi, Oem/odm
Qetello ea Bokaholimo: Hasl, Hasl e etella pele mahala
Koloi e tjhajang qubu ea PCBA motherboard ke karolo ea mantlha e sebelisoang ho laola qubu ea ho tjhaja.
E na le mesebetsi e fapaneng. Mona ke kenyelletso e khuts'oane ea likarolo tsa eona tsa mantlha:
Matla a ho sebetsa ka matla: PCBA motherboard e na le microprocessor e sebetsang hantle haholo, e ka sebetsanang ka potlako le mesebetsi e sa tšoaneng ea ho laola le ho netefatsa polokeho le botsitso ba ts'ebetso ea ho tjhaja.
Moralo o ruileng oa segokanyimmediamentsi sa sebolokigolo: PCBA motherboard e fana ka mefuta e fapaneng ea li-interfaces, tse kang li-interfaces tsa matla, li-interfaces tsa puisano, joalo-joalo, tse ka finyellang litlhoko tsa phetisetso ea data le litlhoko tsa ho sebelisana le lipontšo pakeng tsa ho tjhaja qubu, likoloi le lisebelisoa tse ling.
Taolo e bohlale ea ho tjhaja: PCBA motherboard e ka laola ka bohlale ho tjhaja hajwale le voltage ho ya ka boemo ba matla a betri le ditlhoko tsa ho tjhaja ho qoba ho tjhaja betri ho feta tekano kapa ho tjhaja ka tlase, ho lelefatsa bophelo ba betri ka katleho.
Ts'ireletso e felletseng: PCBA motherboard e kopanya mesebetsi e fapaneng ea ts'ireletso, joalo ka ts'ireletso e fetang hona joale, ts'ireletso e fetang matla a motlakase, ts'ireletso e tlase ea motlakase, joalo-joalo, e ka felisang phepelo ea motlakase ka nako ha maemo a sa tloaelehang a etsahala ho netefatsa hore ts'ebetso e tloaelehileng ea sistimi. Tšireletseho ea ts'ebetso ea ho tjhaja.
Ho boloka matla le ts'ireletso ea tikoloho: PCBA motherboard e amohela moralo o bolokang matla, o ka fetolang matla a hona joale le motlakase ho latela litlhoko tsa sebele, ho fokotsa tšebeliso ea matla ka katleho le ho fokotsa tšusumetso tikolohong.
Ho bonolo ho boloka le ho ntlafatsa: PCBA motherboard e na le scalability e ntle le ho lumellana, e leng ho nolofalletsang tlhokomelo le ho ntlafatsa hamorao, 'me e ka ikamahanya le liphetoho tsa mefuta e fapaneng le litlhoko tse fapaneng tsa ho tjhaja.
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Lintlha tsa bohlokoa / Likarolo tse Khethehileng:
lera: 1-28 Board botenya: 1.6mm
min. boholo ba lesoba: 0.2mm min line. bophara: 4mil
sebaka sa min line: 4mil Botenya ba Koporo: 1OZ
mmala:Blue Finished surface:HASL
Ts'ebeletso ea Tlhahiso ea PCB.
Thepa e sa Lebelloang Lelakabe: V0, V1, V2
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
lintho tse bonahalang: Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, The Paper Ring Gas Resin
Mechanical e thata: E Fexible
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
Sesebelisoa sa elektroniki, Oem elektroniki, Telecommunication
Mofuta oa Bafani:
Feme, Moetsi, Oem/odm
Qetello ea Bokaholimo:
Hasl, Hasl etella pele mahala
Thepa ea Flame Retardant:
V0, V1, V2
Lisebelisoa tsa Insulation:
Epoxy Resin, Metal Composite Materials, Organic Resin
Boitsebiso:
Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, The Paper Ring Gas Resin
Mechanical Rigid:
Fexible
Theknoloji ea Ts'ebetso:
Liehetsa Khatello Foil, Electrolytic Foil
1. Ho tjhaja ka potlako haholo: puisano e kopantseng le DC two-way transformation
2. Bokhoni bo phahameng: Amohela moralo oa theknoloji e tsoetseng pele, tahlehelo e tlase, mocheso o tlase, ho boloka matla a betri, ho eketsa nako ea ho tsoa.
DDR4 SDRAM: 16GBDDR4 Sebopeho se seng le se seng sa 16bit sa bophara ba data ea 64bit bit
QSPI Flash: Sekhechana sa 1GBQSPIFLASH, se sebelisetsoang ho boloka faele ea tlhophiso ea chip ea FPGA.
FPGA Bank: 12V, 18V, 2.5V, 3.0V level, haeba u hloka ho fetola boemo, u hloka feela ho fetola
Memori: 2 likotoana 512MB kakaretso 1GB, 32bit, bakeng sa cache ya data
QSPIFLASH: Likotoana tse peli tsa 256mbitOSPIFLASH, tse sebelisoang e le lifaele tsa tlhophiso ea FPGA le polokelo ea data ea mosebelisi.
Crystal: 1 50MHz e nang le kristale ea mohloli, e fanang ka oache ea ho kenya litšupiso bakeng sa FPGA
QSPI Flash: Sekhechana sa 128mbit QSPIFLASH, se ka sebelisoang bakeng sa lifaele tsa tlhophiso tsa FPGA le polokelo ea data ea basebelisi.
PCLEX8 segokanyimmediamentsi sa sebolokigolo: PCLEX8 e tloaelehileng segokanyimmediamentsi sa sebolokigolo sebelisoa ho buisana le PCIE puisano ea motherboard khomphuta. E tšehetsa PCI, Express 2.0 standard. Sekhahla sa puisano sa mocha o le mong se ka ba holimo ho 5Gbps
USB UART serial port: Sebaka sa serial, se hokela ho PC ka thapo ea miniusb ho etsa puisano ea serial.