China Double-side PCB Assembly OEM Manufacturing Electronic Component Sourcing PCBA Fabrication Turn-key Service
| Turnkey PCBA | PCB+likarolo tsa sourcing+assembly+package+shipment |
| Lintlha tsa kopano | SMT le Thru-hole, ISO SMT le DIP mela |
| Lead time | Prototype: 15 matsatsi a mosebetsi.Taelo e kholo: 20 ~ 25 matsatsi a mosebetsi |
| Ho hlahloba lihlahisoa | Teko ea Flying Probe, Tlhahlobo ea X-ray, Teko ea AOI, Teko e sebetsang |
| Bongata | Palo e nyane: 1pcs.Prototype, taelo e nyane, tatellano ea bongata, tsohle li lokile |
| Lifaele tse hlokahalang | PCB: Lifaele tsa Gerber (CAM, PCB, PCBDOC) Likaroloana: Bili ea Lisebelisoa (Lethathamo la BOM) Kopano: Faele ea Pick-N-Place |
| PCB Panel boholo | Boholo bo fokolang: 0.25 * 0.25 inch (6 * 6mm) Boholo bo boholo: 20 * 20 inches (500 * 500mm) |
| Mofuta oa PCB Solder | Metsi a Soluble Solder Paste, RoHS e etella pele mahala |
| Lintlha tsa likarolo | Phahamisa ho ea ho 0201 boholo BGA le VFBGA Li-Leadless Chip Carriers / CSP Kopano ea SMT e mahlakoreng a mabeli Phapang e ntle ho isa ho 0.8mils BGA Tokiso le Reball Ho Tlosa Karolo le Phetoho |
| Sephutheloana sa likarolo | Seha Tape, Tube, Reels, Likarolo tse Lose |
Re romelle faele ea Gerber/PCB, lintlha tsa PCB, lenane la BOM le litlhoko tse khethehileng tsa kopano kahoo re tla u qotsa litheko tse ntle ka ho fetisisa tsa PCBA nakong ea matsatsi a 1-3.
PCB Bare Board:
Multi-layer, FR4, Metal, Creamic, Rogers, FPC, HDI board.
HASL,Immersion Gold/silevera/Au,OSP, joalo-joalo.
Kopano ea PCB:
9 Mekhoa ea Teko, 100% e Lekoa ho sebetsa.
BGA e nang le X-Ray le Lead Free Assembly.
Ho fumana likarolo:
Lilemo tse 15 tsa Boiphihlelo ba ho Reka.
Phepelo ea likarolo tse ngata.
Ho kopanya lihlahisoa tse felileng:
Teko ea ts'ebetso / Lenaneo.
Conformal Coating.Teko e tukang.
Ho Paka Lebokose la Limpho.Tšebeletso ea Lebenkele.
Melemo ea morero oa OEM:
1. Sehlopha sa boenjiniere se matla
2. Ts'ebeletso e sebetsang hantle le e bonolo ea One-stop Turnkey
3. Ketane ea phepelo e felletseng ho netefatsa nako ea EB,PP&MP
4. Litšenyehelo tsa moralo le thepa li theohile
Melemo ea morero oa ODM:
1. Sehlopha sa setsebi sa R&D ho ts'ehetsa litlhoko tsa bareki
2. Etsa li-platform tsa software
3. Tsamaiso ea merero e nang le boiphihlelo
4. Ha ho MOQ le ho fana ka potlako
Lihlahisoa tsa OEM:
Limilione tsa liboto tsa potoloho li hlahisoa mona selemo se seng le se seng, tse fanang ka lits'ebeletso tse holimo bakeng sa lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa elektroniki tsa bongaka, likhokahano tsa motlakase, li-automation tsa indasteri, lehae le bohlale le liindasteri tse ling ho pota lefatše.
