Feature:Ts'ehetso ea tloaelo
Layers:Habeli-Layer, Multilayer, One-Layer
Ho roala ka Metal:Silver, Tin
Mokhoa oa Tlhahiso:SMT
Mofuta:BMS PCBA, Puisano PCBA, Consumer electronics PCBA, Home appliance PCBA, LED PCBA, Motherboard PCBA, Smart electronics PCBA, Wireless tjhaja PCBA
Kopo: Sesebelisoa sa elektroniki, Oem elektroniki
Mofuta oa Bafani: Feme, Moetsi, Oem/odm
Qetello ea Bokaholimo: Hasl, Hasl e etella pele mahala
Nomoro ea Mohlala: SHE75192A-101H(A1)
Sebaka sa Tšimoloho: Guangdong, China
Lebitso la Brand: Sanhua
Botenya ba Koporo: 5 oz
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
Matla a thekenoloji a ho beoa ha boto a phahameng a hokahaneng
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
Re baetsi ba lihlahisoa tse ngata tsa PCB profinseng ea Shenzhen China, ka tumello ea UL le TS 16949, sebaka sa rona se haufi le Shanghai ka lipalangoang tse bonolo.
Lihlahisoa tsa rona tse sebelisoang haholo ho mabone a LED a kahare le ka ntle, mabone a koloi le masimo a mabone a morao le tse ling,
Li-PCB tsohle tsa MC li entsoe ka mokhoa o ikhethileng, ka kopo romella faele ea Gerber le litlhoko tsa qotso.
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
XinDaChang e ikhethile libakeng tse latelang:
PCBA clone le PCB kopano PCB sebopeho le maqakabetsi.
Lead- Free HASL / Plating khauta / qoelisoa khauta / Ni / Au Plating khauta monoana.
Theko ea likarolo.
Mofani oa litharollo tse kopaneng.
Lehlakore le le leng, mahlakore a mabeli, a mangata.
Ho tenyetseha, ho ipapisitse le litlhoko tsa moreki.
Botala/ Botšo/ Bokhubelu/ Bosehla/ Bosoeu/ Boputsoa…
Ho fana ka lihlahisoa ka theko ea tlholisano.
Nako e khutšoanyane ea ho tsamaisa.
Kopo:
Aerospace, BMS, Puisano, Khomphuta, Disebediswa tsa Elektronike tsa Bareki, Sesebediswa sa lapeng, LED, Disebediswa tsa Kalafo, Leboto la Mme, Disebediswa tsa elektroniki tse bohlale, ho tjhaja o sena mohala.
Sebopeho:Fexible PCB, High density PCB.
Lisebelisoa tsa Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin.
Boitsebiso:Aluminium E Koahetseng Lera la Letlapa la Koporo, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber.
Theknoloji ea Ts'ebetso: Liehetsa Khatello Foil, Electrolytic Foil.
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
Tšebeletso ea Rōna
• One-stop turnkey OEM/ODM PCBA ditshebeletso.
• pcb,pcb moralo,PCBA, PCB kopano: SMT, PTH le BGA,Contract Manufacturing,Tšebeletso ea Turnkey,Litšebeletso tsa Boenjiniere.
• Ho fumana le ho reka lisebelisoa tsa elektronike.
• Ho chesoa ha lenaneo.
• Teko: AOI, X-Ray, tlhahlobo ea potoloho (ICT), tlhahlobo ea ts'ebetso (FCT).
• Prototyping e potlakileng, NPI, DFM/DFT, tlhahiso ea thepa, moralo oa ho paka.
• Ho roala lithapo, ho kopanya lithapo, ho kopanya litšepe tsa lakane ,Polasetiki le Mould.
• Kopano ea ho qetela ea sehlahisoa.
Litlhaloso / Likarolo tsa mantlha:
Molemo oa rona
• Phihlelo e ruileng ea tšebeletso ea tlhahiso ea elektronike bakeng sa PCB PCBA.
• Tšebeletso e le 'ngoe | | Ho reka likarolo tsa thepa ea PCB le kopano ea PCB, ho u thusa ho fihlela lihlahisoa tsa hau tsa elektroniki habonolo.
• Re sebelisana 'moho indastering e kenyelletsang likhokahano tsa mehala, Marang-rang a Lintho, maqhubu a seea-le-moea, taolo ea bohlale, ts'ireletso, bongaka, indasteri,likoloi, lihlahisoa tsa 3G/4G/5G.
• Theko e utloahalang le e tsitsitseng: Ho thehiloe ketane e matla ea lefats'e ea phepelo ea likarolo tsa elektronike ho re thusa ho fumana litheko tse utloahalang le tse tsitsitseng.
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
PCB e kopanya lintlha tsa bohlokoa / likarolo tse ikhethang:
Litšebeletso tsa rona tsa tlhahiso ea konteraka ea PCB/OEM/ODM ka lilemo tse 10:
Boqapi le sebopeho sa PCB: 1 ho isa ho 20 layers
Likarolo tsa bokhoni ba ho reka thepa lefatšeng ka bophara
Bokhoni ba mochini
Kopano ea PCB (SMT + DIP + lenaneo + tlhahlobo)
Litlhaloso tsa bohlokoa / likarolo tse khethehileng:
Seo XinDaChang e ka fanang ka sona:
1. Kopano ea Boto ea Potoloho e hatisitsoeng
2. Kopano ea Turnkey & Box Build
3. Thekenoloji e tsoakiloeng PCB kopano
4. Kopano ea lithapo le terata
5. Tlase / Mid / High volum PCB kopano
6. Kopano ea BGA / QFN e nang le tlhahlobo ea X-ray
7. Lenaneo la IC / Teko ea mosebetsi / tlhahlobo ea ICT
8. Karabelo e potlakileng e kenyelletsa khotheishene le lipuisano le ho fana ka thepa
Kopo:
Aerospace, BMS, Puisano, Khomphuta, Disebediswa tsa Elektronike tsa Bareki, Sesebediswa sa lapeng, LED, Disebediswa tsa Kalafo, Leboto la Mme, Disebediswa tsa elektroniki tse bohlale, ho tjhaja o sena mohala.
Sebopeho:Fexible PCB, High density PCB.
Lisebelisoa tsa Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin.
Boitsebiso:Aluminium E Koahetseng Lera la Letlapa la Koporo, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber.
Theknoloji ea Ts'ebetso: Liehetsa Khatello Foil, Electrolytic Foil