Lihlahisoa
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Oem Pcba Customized Assembly Board Pcba Assembly Services
Kopo: Aerospace, BMS, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Letlapa la 'Mè, Smart electronics, ho tjhaja Wireless
Tšobotsi: Fexible PCB, High density PCB
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
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OEM Intelligent Security PCB moetsi
Likarolo: 1-22 layers
botenya boto: 1.6 limilimithara
Botenya ba koporo: 1 OZ
Boitsebiso ba motheo: FR4
Bonyane boholo ba lesoba: 0.2mm
Bophahamo bo fokolang ba mola: 4 mil
Sebaka se felileng: etella HASL ea mahala
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OEM Fast 5 Single Ports Ethernet Switch Board 10/100M e sa laoloang Half-Full Duplex Lay2 PCBA Module
HT-S1105DS ke mini-compact soho 5 koung 10/100mbps 4pin hlooho netweke switjha PCBA. E na le 5 10/100mbps 4pin head port e hahiloeng ka hare. Plug n play, ha ho hlokahale ho e hlophisa. Matla a kenang ke 3.3V.
Matla, li-link / act lead indicators li fana ka tharollo ea mathata a potlakileng. -
Mabone a LED le mabone a Surface Mount PCB Terminal Blocks
Nomoro ea mohlala: TC280
Sehlopha: Li-Block tsa Terminal tsa Mount PCB
Lipotoloho: 2Pin
Boemo ba hajoale: 3.0A
Tekanyo ea matla: 200V
PC Board Mounting Direction: Ho kena ka lehlakore -
Keyboard pcb boto sebelisoa ka sesebelisoa Medical le kopano BGA le ISO 13485
Thepa e sa Khanyang lelakabe:V1
Lisebelisoa tsa Insulation: Resin ea maiketsetso
lintho tse bonahalang: Letlapa la Fiberglass
Mechanical e thata: E Fexible
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
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Multilayer ea Multilayer ea Moea o chesang e nang le Mekhahlelo e Mene
Kopo: Puisano, Khomphuta, Disebediswa tsa Elektronike tsa Bareki, Sesebediswa sa lapeng, Lisebelisoa tsa Bongaka, Letlapa la 'Mè, Smart electronics, ho tjhaja ntle ho mohala.
Tšobotsi: Fexible PCB, High density PCB
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials
lintho tse bonahalang: Fiberglass Epoxy Resin & Polyimide Resin
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
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High Quality OEM Top PCB Laminate e nang le Setifikeiti sa UL
Kopo: Aerospace, BMS, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Letlapa la 'Mè, Smart electronics, ho tjhaja Wireless
Tšobotsi: Fexible PCB, High density PCB
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
lintho tse bonahalang: Aluminium e Koaheletsoeng ka Koporo Lera, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
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ENIG PCB ea boleng bo holimo bakeng sa lisebelisoa tsa bongaka Sebaka sa tšireletso sa sesole sa Aerospace Botenya ba khauta 1u”-3u”
Re etsa lifeme tsa tšebeletso tsa pcb le pcb tse emisang tšebeletso e le 'ngoe. e na le batho ba 400 ka kakaretso. 20% e eketsa palo ea thekiso selemo le selemo. 70% tlhahiso kaofela ho tsoa mose ho maoatle. re etsa 1-12layer.FR4.CEM-1.CEM-3.HDI. Lisebelisoa tsa AL.
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Boleng bo phahameng customization pcb tlhahiso boto elektroniki potoloho pcb Puisano mojule PCB
Aerospace, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Motherboard, Smart electronics, Ho tjhaja Wireless
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FR4 Hdi habeli mahlakoreng a elektronike potoloho boto pcbs
Thepa e sa Lebelloang Lelakabe: V0, V1, V2
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
lintho tse bonahalang: Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, The Paper Ring Gas Resin
Mechanical e thata: E Fexible
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FPC PCB e Rigid Flexible multilayer
Tšobotsi: Rigid Flex pcb
Lera: Multilayer
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Firmware Decode PCB Copy PCB Clone PCB software e nts'etsapele PCBA Reversing Engineering Service
Kopo:
Aerospace, BMS, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Motherboard, Smart electronics, ho tjhaja Wireless
Lisebelisoa tsa Insulation:
Epoxy Resin, Metal Composite Materials, Organic Resin
Boitsebiso:
Aluminium e Koaheletsoeng ka Letlapa la Koporo, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Theknoloji ea Ts'ebetso:
Liehetsa Khatello Foil, Electrolytic Foil
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Mohala
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