PCB Assemblies Manufacturer PCBA Boards SMT&DIP process Supplier wifi wireless router electronic circuit pcba
| Mekhahlelo | 1-32 methati |
| Lisebelisoa | CEM1,CEM3,Teflon,Rogers,FR-4,High Tg FR-4,Aluminium Base,Halogen Free |
| Max. Boto ea Boto | 510 * 1200mm |
| Lintho tse bonahalang | RoHS Directive-e lumellana |
| Botenya ba PCB | 1.6 ±0.1mm |
| Out Layer Koporo Botenya | 1-6oz |
| Lera le ka Hare Botenya ba Koporo | 1/2 oz-5oz |
| Max. boto Botenya | 6.0 limilimithara |
| Bonyane ba lesoba la boholo | 0.20 limilimithara |
| Bonnyane ba mola/sebaka | 3/3 mil |
| Min. S/M Pitch | 0.1mm(4mil) |
| Botenya ba poleiti le karo-karolelano ea ho bula | 30:1 |
| Bonyane ba lesoba koporo | 20µm |
| Hole dia. Mamello(PTH) | ±0.075mm(3mil) |
| Hole dia. Mamello(NPTH) | ±0.05mm (2mil) |
| Ho kheloha boemo ba lesoba | ±0.05mm (2mil) |
| Hlalosa mamello | ±0.05mm (2mil) |
| Sebaka se felile | HASL Leadfree,Ho qoelisoa ENIG,Chem Tin,Flash Gold,OSP,Monoana oa Khauta,O ka peeletsoang,Silivera e qoelisoang |
| Maske a solder | botala |
| Tšōmo | tšoeu |
| Kemiso | rout and score/V-cut |
| Teko ea E | 100% |
| Tekanyetso ea ho hlahloba | IPC-A-600H/IPC-6012B, Sehlopha sa 2 |
| Litlaleho tse tsoang | tlhahlobo ea ho qetela, tlhahlobo ea E, tlhahlobo ea solderability, karolo e nyane le tse ling |
| Litifikeiti | UL (E315391), ISO 14001, TS16949, ISO 9001, SGS |
- Ho reka lisebelisoa tsa elektronike
- Moqapi oa PCB o se nang letho
- Tšebeletso ea Kopano ea PCB. (SMT, BGA, DIP)
- Teko E FELETSENG: AOI, Teko ea Ka hare ho Potoloho (ICT), Teko ea Mosebetsi (FCT)
- Cable, Wire-harness assembly, sheet metal, Electrical cabinet Assembly service
- Tšebeletso ea ho roala ka mokhoa o hlophisitsoeng
- Prototyping le tlhahiso ea bongata...
- Sebopeho sa PCB, moralo oa PCBA ho latela mohopolo oa hau
- PCBA kopi / clone
- Moralo oa Potoloho ea Dijithale / Moralo oa Potoloho ea Analog/ Moqapi oa lRF / Moralo oa Software o Embedded
- Firmware le Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
- Moralo o Kenyellelitsoeng oa Sehokelo sa Mosebelisi / Moralo oa Hardware oa lSystem...
- 1.Tlhahlobo ea litlhoko tsa bareki
- 2.Design for Testability (DFT)
- 3.Design for Excellence (DFX) Analysis
- 4.Virtual Prototyping-Valor Software
- 5.Litataiso tsa ho etsa liteko li fanoe
- 6.Teko ea Ts'ebetso le Nts'etsopele
- 7.In-Circuit Testing & Development
- 8.Dynamic ho chesa ka ho feletseng mocheso baesekele
- 9.Troubleshoot ho boemo ba karolo
- 10.Litšebeletso tsa Boenjiniere
Lenaneo la XinDaChang'S Materials Management le fa bareki ba rona thomello ea JIT (ka nako e loketseng) ho amohela thomello ea lihlahisoa ho fihlela litlhoko tsa Nako-to-Market:
1.Sistimi e felletseng ea MRP
2.VMI (The Vendor Managed Inventory)
3.Limited Received & Tlhahlobo
4.Computerized Tracking & Material Boemo
5.Dashboard Tharollo
Lenaneo la 6.Auto Replenishment
Tlhahlobo ea 7.100% ho AVL ea bareki (Lethathamo le Amoheletsoeng la Barekisi)
8.FIFO (First-in/ Ea pele)
9.Weekly Rolling Build Forecast to Suppliers
Joalo ka moetapele oa indasteri ho tsamaiseng phepelo ea thepa, XinDaChang e fa bareki litharollo tse pharalletseng le tse felletseng tsa ho nyolla kakaretso ea khoebo ka barekisi ba mahlale:
1.SQM (Taolo ea Boleng ba Bafani)
2.Supplier Performance System Ntlafatso
3.Supplier Replenishment Program
4.Drive Quality Khutlela ho Suppliers
5.Dock-to-Dock with Suppliers
- Sebopeho sa PCB, moralo oa PCBA ho latela mohopolo oa hau
- PCBA kopi / clone
- Moralo oa Potoloho ea Dijithale / Moralo oa Potoloho ea Analog/ Moqapi oa lRF / Moralo oa Software o Embedded
- Firmware le Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
- Moralo o Kenyellelitsoeng oa Sehokelo sa Mosebelisi / Moralo oa Hardware oa lSystem...
| Boema-kepe ba FOB | Shenzhen |
| Boima ka Yuniti | 0.8 lik'hilograma |
| Khoutu ea HTS | 8534.00.90 00 |
| Thepa Likhathone tsa Thepa L/W/H | 58.0 x 58.0 x 1.8 Disentimetara |
| Lead time | Matsatsi a 15-20 |
| Litekanyo ka Unit | 25.0 x 20.0 x 0.6 Disentimitara |
| Diyuniti ho ya ka Lebokose la Thomello | 40.0 |
| Export Carton Weight | 2.0 lik'hilograma |
- - Asia
- - Australasia
- - Amerika Bohareng / Boroa
- - Europe Bochabela
- - Middle East/Africa
- - Amerika e leboea
- - Europe Bophirimela
A: PCB: Bongata, faele ea Gerber le litlhoko tsa Technic (lisebelisoa, kalafo ea ho qetela ea sefahleho, botenya ba koporo, botenya ba boto, ...)
PCBA: Litaba tsa PCB, BOM, (Litokomane tsa liteko ...)
A: Faele ea Gerber: CAM350 RS274X
PCB faele: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF, lentsoe, txt)
A: Lifaele tsa hau li bolokiloe ka tšireletseho e feletseng. Re sireletsa thepa ea bohlale bakeng sa bareki ba rona ts'ebetsong eohle. Litokomane tsohle tse tsoang ho bareki ha ho mohla li arolelanoang le batho ba bang.
A: Ha ho na MOQ. Re khona ho sebetsana le Nyenyane hammoho le tlhahiso e kholo ea molumo ka ho feto-fetoha ha maemo.
A: Litsenyehelo tsa ho tsamaisa thepa li khethoa ke sebaka seo u eang ho sona, boima ba 'mele, boholo ba thepa. Ka kopo, re tsebise haeba u hloka hore re u qotse litšenyehelo tsa ho romella.
A: E, re ka fana ka mohloli oa likarolo, hape re amohela karolo ho tsoa ho bareki.
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