Kopo: Aerospace, BMS, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Letlapa la 'Mè, Smart electronics, ho tjhaja Wireless
Tšobotsi: Fexible PCB, High density PCB
Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin
lintho tse bonahalang: Aluminium e Koaheletsoeng ka Koporo Lera, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic
Boto e ncha ea taolo ea matla e na le litšobotsi tsa ho kopanya ho phahameng, ho laola ka bohlale, mesebetsi ea tšireletso, mesebetsi ea puisano, ho boloka matla le ho sireletsa tikoloho, ho tšepahala ho phahameng, tšireletso e matla le tlhokomelo e bonolo. Ke karolo ea bohlokoa ea lisebelisoa tse ncha tsa matla. Litlhoko tsa eona tsa ts'ebetso li kenyelletsa ho hanyetsa motlakase, ho hanyetsa hona joale, ho hanyetsa mocheso, ho hanyetsa mongobo, ho hanyetsa kutu, ho tšoarella le litšobotsi tse ling ho netefatsa botsitso le ho tšepahala ha lisebelisoa. Ka nako e ts'oanang, mapolanka a macha a ho laola matla a boetse a hloka ho ba le bokhoni bo botle ba ho thibela ho kena-kenana.
E sebelisoa haholo ho matla a tsosolositsoeng, likoloi tsa motlakase, li-grids tse bohlale le masimo a mang. Ke e 'ngoe ea mahlale a bohlokoa ho fihlela tšebeliso e nepahetseng ea matla a macha le paballo ea matla le phokotso ea mosi ho sebetsana le maemo a thata a ts'ebetso.
Koloi e tjhajang qubu ea PCBA motherboard ke karolo ea mantlha e sebelisoang ho laola qubu ea ho tjhaja.
E na le mesebetsi e fapaneng. Mona ke kenyelletso e khuts'oane ea likarolo tsa eona tsa mantlha:
Matla a ho sebetsa ka matla: PCBA motherboard e na le microprocessor e sebetsang hantle haholo, e ka sebetsanang ka potlako le mesebetsi e sa tšoaneng ea ho laola le ho netefatsa polokeho le botsitso ba ts'ebetso ea ho tjhaja.
Moralo o ruileng oa segokanyimmediamentsi sa sebolokigolo: PCBA motherboard e fana ka mefuta e fapaneng ea li-interfaces, tse kang li-interfaces tsa matla, li-interfaces tsa puisano, joalo-joalo, tse ka finyellang litlhoko tsa phetisetso ea data le litlhoko tsa ho sebelisana le lipontšo pakeng tsa ho tjhaja qubu, likoloi le lisebelisoa tse ling.
Taolo e bohlale ea ho tjhaja: PCBA motherboard e ka laola ka bohlale ho tjhaja hajwale le voltage ho ya ka boemo ba matla a betri le ditlhoko tsa ho tjhaja ho qoba ho tjhaja betri ho feta tekano kapa ho tjhaja ka tlase, ho lelefatsa bophelo ba betri ka katleho.
Ts'ireletso e felletseng: PCBA motherboard e kopanya mesebetsi e fapaneng ea ts'ireletso, joalo ka ts'ireletso e fetang hona joale, ts'ireletso e fetang matla a motlakase, ts'ireletso e tlase ea motlakase, joalo-joalo, e ka felisang phepelo ea motlakase ka nako ha maemo a sa tloaelehang a etsahala ho netefatsa hore ts'ebetso e tloaelehileng ea sistimi. Tšireletseho ea ts'ebetso ea ho tjhaja.
Ho boloka matla le ts'ireletso ea tikoloho: PCBA motherboard e amohela moralo o bolokang matla, o ka fetolang matla a hona joale le motlakase ho latela litlhoko tsa sebele, ho fokotsa tšebeliso ea matla ka katleho le ho fokotsa tšusumetso tikolohong.
Ho bonolo ho boloka le ho ntlafatsa: PCBA motherboard e na le scalability e ntle le ho lumellana, e leng ho nolofalletsang tlhokomelo le ho ntlafatsa hamorao, 'me e ka ikamahanya le liphetoho tsa mefuta e fapaneng le litlhoko tse fapaneng tsa ho tjhaja.
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Indasteri-grade motherboard PCBA e hloka ho ba le tshebetso e babatsehang le botsitso 'me e loketse liindasteri tse sa tšoaneng, liroboto, lisebelisoa tsa bongaka le lisebelisoa tse ling. Khokahano ea eona e tšepahalang haholo le moralo oa moralo o netefatsa hore board ea mama e ke ke ea sebetsa hampe nakong ea ts'ebetso ea nako e telele, ho ntlafatsa ts'ebetso ka kakaretso le bophelo ba ts'ebeletso ea sesebelisoa.
Ho phaella moo, motherboard PCBA na le sebeletsana e ntle le scalability, e lumella hore e ho hokela le ho atolosa le peripherals tse fapa-fapaneng le lisensara ho kopana le litlhoko tsa maemo a fapaneng a kopo. Ka nako e ts'oanang, lisebelisoa tsa eona tse bonolo tsa tlhokomelo le ntlafatso li fokotsa litšenyehelo tsa tšebeliso le mathata a tlhokomelo.
1. Kopo: UAV (khatello e kopaneng ea maqhubu a phahameng)
Palo ea mekato: 4
Botenya ba poleiti: 0.8mm
Bolelele ba mola oa bophara: 2.5/2.5mil
Phekolo ea holim'a metsi: Tin
1.Application: electrocardiogram detector
Palo ea mekato: 8
Botenya ba poleiti: 1.2mm
Bolelele ba mola oa bophara: 3/3mil
Phekolo ea bokaholimo: Khauta e tebileng
1.Kopo: terminal e bohlale ea mohala
Palo ea lihlopha: Likarolo tse 12 tsa boto ea 3 ea HDI
Botenya ba poleiti: 0.8mm
Bolelele ba mola oa bophara: 2/2mil
Phekolo ea sefahleho: khauta + OSP
1.Kopo: Boto ea lebone la likoloi (aluminium base)
Palo ea mekato: 2
Botenya ba poleiti: 1.2mm
Sekhahla sa mola oa bophara ba mela: /
Phekolo ea holim'a metsi: Fafatsa thini
1.Applications: Solid state drives
Palo ea mekhahlelo: 12 layers (flexible 2 layers)
Bonyane aperture: 0.2mm
Botenya ba poleiti: 1.6±0.16 limilimithara
Bolelele ba mola oa bophara: 3.5/4.5mil
Phekolo ea bokaholimo: khauta ea nickel e tebisitsoeng
1.Kopo: libeteri tse ncha tsa koloi ea matla
Botenya ba koporo: 2oz
Botenya ba poleiti: 2mm
Bolelele ba mola oa bophara: 6/6mil
Qetella: Khauta e tekiloeng
Kopo: Limithara tse bohlale
Nomoro ea mohlala: M02R04117
Plate: Ultrasonic GW1500
Botenya ba poleiti: 1.6+/-0.14mm
Boholo: 131mm * 137mm
Bonyane aperture: 0.4mm