Lera | 6 matlalo |
Lintho tse bonahalang | FR-4 |
Botenya ba Koporo (ka OZ) | 1OZ |
Qetella Botenya ba Boto | 1.6 limilimithara±0.1mm |
Mask ea solder | Botala |
Silkscreen | Bosoeu |
Surface Finish | HASL |
Bonnyane ba bophara ba mela le sebaka sa mela | 4/5 mil |
Boleng | Tlhaloso |
Lintho tse bonahalang | FR-4, FR1, CEM-1, CEM-3,Aluminium, Ceramic, Metal-backed Laminate, joalo-joalo Hape etsa Crockery, Taconic, Rogers PCBs joalo-joalo. |
Litlhaloso | Tg CCL e Phahameng ea Fumaneha(Tg>=170℃) |
Qetella Botenya ba Boto | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Monoana oa khauta(>=0.13um), Khauta e Kentsoeng(0.025-0075um), Khauta ea Plating(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Sebopeho | Ho tsamaisa tsela,Tebela,V-cut,Chamfer |
Phekolo ea Bokaholimo | Solder Mask (e ntšo, e tala, e tšoeu, e khubelu, e putsoa, botenya> = 12um, Block, BGA) |
Silkscreen (e ntšo, e mosehla, e tšoeu) | |
Mask e khonang ea peel (e khubelu, e putsoa, botenya> = 300um) | |
Bonyane Core | 0.075mm(3mil) |
Botenya ba Koporo | 1/2 oz min; 12oz max |
Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
Min Hole Diameter bakeng sa ho Drilling ea CNC | 0.1mm(4mil) |
Min Hole Diameter bakeng sa ho phunya | 0.6mm(35mil) |
Boholo bo boholo ba phanele | 610mm * 508mm |
Boemo ba lesoba | +/-0.075mm(3mil) CNC Drilling |
Bophara ba Mokhanni(W) | +/-0.05mm(2mil) kapa +/-20% ea mantlha |
Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
E seng PTHL:+/-0.05mm(2mil) | |
Hlalosa Mamello | +/-0.1mm(5mil) CNC Routing |
Warp & Twist | 0.70% |
Khanyetso ea Insulation | 10Kohm-20Mohm |
Boikhantšo | <50 ohm |
Teko ea Voltage | 10-300V |
Boholo ba Panel | 110 x 100mm(mets) |
660 x 600mm(boholo) | |
Ngoliso e fosahetseng ea lera | 4 mealo:0.15mm(6mil)max |
6 mealo:0.25mm(10mil)max | |
Sebaka se senyenyane pakeng tsa sekoti ho ea ho paterone ea potoloho ea lera le ka hare | 0.25mm(10mil) |
Sebaka se senyenyane pakeng tsa boto le paterone ea potoloho ea lera le ka hare | 0.25mm(10mil) |
Mamello ea botenya ba boto | 4 mekhahlelo:+/-0.13mm(5mil) |
Boema-kepe ba FOB | Shenzhen |
Boima ka Yuniti | 10.0 lik'hilograma |
Khoutu ea HTS | 8534.00.90 00 |
Thepa Likhathone tsa Thepa L/W/H | 44.0 x 30.0 x 34.0 Disentimetara |
Litšobotsi tsa Logistics | Tloaelehileng |
Lead time | 7-15 matsatsi |
Litekanyo ka Unit | 10.0 x 5.0 x 0.16 Disentimitara |
Diyuniti ho ya ka Lebokose la Thomello | 5000.0 |
Export Carton Weight | 5.0 lik'hilograma |
A: Gerber, Protel 99SE, DXP, PADS 9.5, AUTOCAD, CAM350 li lokile.
A: 1pcs. Mehlala ea tlhahiso ea bongata bohle e ka tšehetsoa ke XinDaChang.
A: AOI, Fly probe test, Text fixture test, FOC joalo-joalo bakeng sa PCB e se nang letho.
A: E, re na le sehlopha sa meralo se kenyelletsang software, hardware le lienjineri tsa meralo.
Re ka fana ka litšebeletso tsa moralo o hlophisitsoeng. Fana ka maikutlo a hau 'me re ka o etsa 'nete.
A: T/T, PayPal, Gram ea Chelete joalo-joalo.