OEM PCBA Clone Assembly Service Tse ling PCB & PCBA Custom Electronics PCB Potoloho Board

Tlhaloso

PCB Bokhoni ba Tekheniki

Likarolo Tlhahiso e kholo: 2 ~ 58 layers / Pilot run: 64 layers

Max. Botenya Tlhahiso e kholo: 394mil (10mm) / Pilot run: 17.5mm

Materials FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, lead free assembly material) , Halogen-Free, Ceramic e tlatsitsoe, Teflon, Polyimide, BT,PPO,PPE, Hybrid, Partial hybrid, joalo-joalo.

Min. Bophara/Sepakapaka Lera le ka hare: 3mil/3mil (HOZ), Lera la ka ntle: 4mil/4mil(1OZ)

Max. Botenya ba Koporo 6.0 OZ / Pilot run: 12OZ

Min. Ho cheka Mocheni oa Lesoba: 8mil(0.2mm) Laser ea cheka: 3mil(0.075mm)

Surface Finish HASL,Khauta e qoelisoang, Tin ea ho qoelisoa, OSP, ENIG + OSP, Ho qoelisoa, ENEPIG, Monoana oa Khauta

Sekoti se Epetsoeng ka Mokhoa o Khethehileng, Sekoti se Foufetseng, Khanyetso e Kenyelelitsoeng, Bokhoni bo Kenyellelitsoeng, Hybrid, Lebasetere la Karolo, Boima bo phahameng bo sa fellang, Ho cheka ka morao, le Taolo ea Resistance.

PCBA botekgeniki bokgoni

Melemo ---- Theknoloji ea Setsebi ea ho roala holim'a sefahleho le ka "hole-hole".

----Me boholo bo fapaneng joalo ka 1206,0805,0603 likarolo tsa theknoloji ea SMT

----ICT(Tekong ea Potoloho),FCT(Teko e sebetsang ea potoloho)

----PCB Kopano Ka UL,CE,FCC,Kamohelo ea Rohs

----Theknoloji ea ho rekisa khase ea naetrojene bakeng sa SMT.

----High Standard SMT&Solder Assembly Line

----- Bokhoni bo phahameng bo hokahaneng ba boto ea ho bea.

Likaroloana tse sa Feleng ho ea ho boholo ba 0201, BGA le VFBGA, Li-Leadless Chip Carriers/CSP

Kopano ea SMT e mahlakoreng a mabeli, Pitch e Ntle ho isa ho 0.8mils, Tokiso ea BGA le Reball

Teko ea Flying Probe, Tlhahlobo ea X-ray ea AOI