Kereiti ya boleng | •E tloaelehileng IPC 2-3 |
Theknoloji ea Kopano | • Li-stencils tsa SMD • PCB Fabrication • Kopano ea SMT PCB • THTkopano • Kopano ea Lithapo tsa Lithapo le Lithapo • E hlophisitsoengHo roala • Likopano tsa Sehokelo sa Mosebelisi • Ho Haha MabokoseKopano • Qetellongkopano ea lihlahisoa |
Litšebeletso tse Ekelitsoeng Boleng | • Ho fumana likarolo • Ho paka le ho pepa • DFM • Ho paka lephano • Mohlala oa PCBA • Sebetsa hape • Lenaneo la IC • Tlaleho ea NPI |
Litifikeiti tsa Khampani | • ISO9001 • IATF16949 • ISO13485 • 14001 |
Setifikeiti sa Sehlahisoa | • UL • RoHS • SGS • REACH |
Matla a Order | • Ha ho na litlhoko tsa MOQ (Bonyane Bonyane ba Odara) |
Mokhoa oa ho Leka | QC tlhahlobo ea matsoho ea SPI(Tlhahlobo ea Solder Paste)X-ray • FAI (sengoloa sa pele tlhahlobo) Teko ea botsofali ea ICT FCT Teko ea ho tšepahala |
Boema-kepe ba FOB | Shenzhen |
Boima ka Yuniti | 150.0 lik'hilograma |
Khoutu ea HTS | 3824.99.70 00 |
Thepa Likhathone tsa Thepa L/W/H | 53.0 x 29.0 x 37.0 Disentimitara |
Lead time | Matsatsi a 14-21 |
Litekanyo ka Unit | 15.0 x 10.0 x 3.0 Disentimitara |
Diyuniti ho ya ka Lebokose la Thomello | 100.0 |
Export Carton Weight | 13.0 lik'hilograma |