Keyboard pcb boto sebelisoa ka Sesebediswa Medical le BGA kopano le ISO 13485 Featured Image

Keyboard pcb boto sebelisoa ka sesebelisoa Medical le kopano BGA le ISO 13485

Tlhaloso e Khutšoanyane:

Thepa e sa Khanyang lelakabe:V1

Lisebelisoa tsa Insulation: Resin ea maiketsetso

lintho tse bonahalang: Letlapa la Fiberglass

Mechanical e thata: E Fexible

Theknoloji ea Ts'ebetso: Foil ea Khatello ea ho lieha, Foil ea Electrolytic

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Litlhaloso tsa Bohlokoa/ Likarolo tse Khethehileng

Ho tloha ho boto e rarahaneng e nang le mekhahlelo e mengata ho isa ho moralo o nang le mahlakore a mabeli a holim'a holim'a metsi, sepheo sa rona ke ho u fa sehlahisoa sa boleng bo khotsofatsang litlhoko tsa hau 'me se boloka chelete e ngata ho se etsa.
Boiphihlelo ba rona ho litekanyetso tsa IPC tsa sehlopha sa III, litlhoko tse thata tsa bohloeki, koporo e boima le mamello ea tlhahiso li re lumella ho fa bareki ba rona seo ba se hlokang bakeng sa sehlahisoa sa bona sa ho qetela.

Lihlahisoa tsa theknoloji e tsoetseng pele:
Liboto tsa morao-rao, liboto tsa HDI, liboto tsa maqhubu a phahameng, liboto tsa TG tse phahameng, liboto tse se nang halogen, liboto tse tenyetsehang le tse thata, tse nyalisitsoeng le liboto life kapa life tse nang le lisebelisoa ho lihlahisoa tsa theknoloji e phahameng.

20-layer PCB, 2 mil sebaka sa bophara ba mela:
Boiphihlelo ba rona ba lilemo tse 10 ba ho etsa thepa, lisebelisoa tsa boleng bo holimo le lisebelisoa tsa tlhahlobo li thusa VIT ho hlahisa liboto tse thata tse 20 le li-circuits tse flex-flex ho fihla ho mekhahlelo e 12.
Botenya ba sefofane bo fihlang ho .276 (7mm), likarolo tse ka bang 20:1, 2/2 mola/sebaka le meralo e laoloang ke impedance e hlahisoa letsatsi le letsatsi.

Tšebeliso ea lihlahisoa le theknoloji:
Etsa kopo ho likhokahano, sefofane, ts'ireletso, IT, lisebelisoa tsa bongaka, lisebelisoa tsa tlhahlobo tse nepahetseng le lik'hamphani tse laolang indasteri

Mekhoa e tloaelehileng ea ts'ebetso ea PCBs:tlhahlobo le litekanyetso tsa tlhahlobo li tla ipapisa le IPC-A-600 le IPC-6012, sehlopha sa 2 ntle le haeba ho boletsoe ka tsela e 'ngoe litšoantšong kapa litlhalosong tsa bareki.

Ts'ebeletso ea moralo oa PCB:VIT hape e ka fana ka ts'ebeletso ea moralo oa PCB ho bareki ba rona
Ka linako tse ling, bareki ba rona ba re fa feela faele ea 2D kapa mohopolo feela, ebe re tla rala PCB, sebopeho le ho ba etsetsa faele ea Gerber.

Ntho	Tlhaloso	Bokhoni ba tekheniki
1	Mekhahlelo	Likarolo tse 1-20
2	Boholo ba boto ea boholo	1200x600mm (47x23")
3	Lisebelisoa	FR-4, TG FR4 e phahameng, thepa ea mahala ea halogen, Rogers, Arlon, PTFE, Taconic, ISOLA, lirafshoa, aluminium, motheo oa koporo
4	Max botenya boto	330mil (8.4mm)
5	Bophara ba mohala o ka hare / sebaka	3mil (0.075mm)/3mil (0.075mm)
6	Bophara ba mola o kantle / sebaka	3mil (0.75mm)/3mil (0.075mm)
7	Min finish lesoba boholo	4mil (0.10mm)
8	Min ka boholo ba lesoba le pad	Ka: bophara ba 0.2mm Pad: bophara ba 0.4mm HDI <0.10mm ka
9	Ho mamellana le lesoba la Min	±0.05mm (NPTH), ±0.076mm (PTH)
10	Mamello ea boholo ba lesoba e felileng (PTH)	±2mil (0.05mm)
11	Mamello ea boholo ba lesoba e felileng (NPTH)	±1mil (0.025mm)
12	Ho mamella ho kheloha boemo ba lesoba	±2mil (0.05mm)
13	Min S/M pitch	3mil (0.075mm)
14	Solder mask thata	≥6H
15	Ho chesa	94V-0
16	Ho qeta bokahodimo	OSP, ENIG, khauta e khanyang, tin e qoelisoang, HASL, tin-plated, silevera e qoelisoang,enke ea khabone, mask a ebolang, menoana ea khauta (30μ"), silevera ea ho qoelisoa (3-10u"), thini ea ho qoelisoa (0.6-1.2um)
17	V-cut angle	30/45/60 °, mamello ± 5 °
18	Min V-seha boto botenya	0.75 limilimithara
19	Min blind/patuwe ka tsela	0.15mm (6mil)