ENIG PCB ea boleng bo holimo bakeng sa lisebelisoa tsa bongaka Sebaka sa tšireletso sa sesole sa Aerospace Botenya ba khauta 1u”-3u”

Re etsa lifeme tsa tšebeletso tsa pcb le pcb tse emisang tšebeletso e le 'ngoe. e na le batho ba 400 ka kakaretso. 20% e eketsa palo ea thekiso selemo le selemo. 70% tlhahiso kaofela ho tsoa mose ho maoatle. re etsa 1-12layer.FR4.CEM-1.CEM-3.HDI. Lisebelisoa tsa AL. re amohela litaelo tsa prototypes. disampole tloaelehileng pcb ka 3days ka delivery re ka romela ho hao ka hare ho 12hour kapa 24hour lefa litšenyehelo tse potlakileng. pcba prototypes mabapi 1day ka pelehi. smt le dip le ka letsoho likarolo tsohle li ka li etsa. kenyeletsa 0201 likarolo.BGA. 100%Tšepiso ea boleng. ka lebaka la Fly probe. Shelofo ea tlhahlobo ea E-testing.X-RAY.AOI. Teko ea mosebetsi bakeng sa boto ka 'ngoe. re ka etsa moralo moralo kapa kopitsa boto haeba ho se na faele ea pcb gerber le lenane la bom. o ka romela mohlala oa hau oa 'nete ho rona haeba o entse joalo. Ka kopo, fana ka setšoantšo sa shematic. boholo ba kemiso. dikarolo haeba ho se disampole nnete. re netefatsa hore re lokisa kapa re hlahisa kapa re jara mathata a boleng haeba boleng bo etsa mahlakore a rona. karabo efe kapa efe e tla arajoa nakong ea lihora tse 5. re na le ISO9001.TS16949.SGS.UL. Setifikeiti sa ROHS. Ke labalabela ho utloa ho tsoa ho uena haufinyane. amohela tlhahiso ea hau haufinyane.

Litekanyetso tsa tekheniki
•Material:FR-4,CEM-3,CEM-1,AL ,HDI, Halogen-free , Ceramic boards
•Min Solder Mask borokho: 0.1mm
• Min/max Solder Mask botenya: 10um-25um
•Motsoako o monyane oa solder bophara:0.1mm(lehlakore le le leng)
•Mamello ea bophara:PTH ±0.076mm NPTH ±0.05mm
•Ho tente ka Mask (e/che):E
•Lipalo tsa Lera:1-12 LAERERS
•Botenya ba Boto: 0.4mm—3.5mm
•Mamello ea Botenya(t≥0.8mm):0.8 +/-0.1mm;1.2-1.6 +/-0.13mm;2.4 +/-0.18mm;3.2 +/-0.25mm
•Mamello ea Botenya( T<0.8mm):0.4-0.6 +/-0.1mm
•Bonyane Mola (0,5OZ):0.10mm(bakeng sa ho pola khauta):Bonyane Sekhoba (0,5OZ)0.10mm(bakeng sa ho maneha khauta)
•Bonyane (1OZ):0.15mm:Minimum Line (2OZ):0.20mm
•Bonyane Mola (3OZ):0.25mm:Bonyane Sekhoba (1OZ):0.15mm
•Bonyane sebaka (2OZ):0.20mm
•Bonyane sebaka (3OZ):0.25mm
• Out Layer Koporo Botenya: 0.5-2OZ
• Lera le ka hare la Koporo Botenya: 0.5-2OZ
•Mokotla o Monyenyane oa ho Sebetsa (E felile):0.25mm
• Ring ea annular: 0.1mm Ngoliso: ± 0.1mm
•Aspect Ratio:Ka Likoti - 8:1
• 'Mala oa Mask oa Solder:Tala, o motšo, o mofubelu, o mosoeu. Mini. Tlhaloso ea Mask ea Solder: 0.05mm
•Mmala oa tšōmo: o motala, o mosoeu, o mokhubelu, o mosehla, o motšo.
• Boholo ba Boto ea Boto: 500x600mm
•Twist and Bow (bakeng sa ho kopana ha SMT):≤0.75%
Botenya Tin / Lead HASL: 5-25um