Kopo:
Aerospace, Puisano, Khomphuta, Consumer Electronics, Sesebelisoa sa lapeng, LED, Lisebelisoa tsa Bongaka, Motherboard, Smart electronics, Ho tjhaja Wireless
Sebopeho:
Fexible PCB, High density PCB
Lisebelisoa tsa Insulation:
Epoxy Resin, Metal Composite Materials, Organic Resin
Boitsebiso: FR-41.6T1/1/1/1 OZ
Bophara bo fokolang ba mola /
Sebaka sa mohala: 6/6mil
Bonyane aperture: 0.3mm
bokaholimo bo felile : oli e tala ea masking nickel khauta 4Layers
Kopo: Letlapa la mama la taolo ea lisebelisoa tsa lapeng
Boitsebiso: FR-4 1.6T 1/1 OZ
Bophara bo fokolang ba mola /
Sebaka sa mohala: 5/5mil
Bonyane aperture: 0.3mm
bokaholimo bo felile : oli e tala ea masking nickel khauta 2Layers
Kopo: Mochini oa ho fiela o bohlale
Boitsebiso: FR-41.6T1/1/1/1 OZ
Bophara bo fokolang ba mola /
Sebaka sa mohala: 6/6mil
Bonyane aperture: 0.3mm
bokaholimo bo felile : oli e ntšo ea masking nickel khauta 6Layers
Kopo: Letlapa la mama la taolo ea lisebelisoa tsa lapeng
Lintho tse bonahalang: FR-41.6T1/1/1 OZ
Bonyane bophara ba mohala / Bohole ba mola: 4/4mi1
Sebaka se fokolang /
Bonyane BGA: 0.25mm / 0.25 * 0.25mm
bokaholimo bo felile: oli e putsoa ea masking nickel khauta 6Layers
Tšebeliso ea Sehlahisoa: Boto ea ho tsamaea ea iRobot