Boto e nepahetseng e phahameng, e sebelisetsoang lisebelisoa tsa bongaka Featured Image

Boto e phahameng ea ho nepahala, e sebelisetsoang lisebelisoa tsa bongaka

Tlhaloso e Khutšoanyane:

Kopo:
Aerospace, BMS, Puisano, Khomphuta, Disebediswa tsa Elektronike tsa Bareki, Sesebediswa sa lapeng, LED, Disebediswa tsa Kalafo, Leboto la Mme, Disebediswa tsa elektroniki tse bohlale, ho tjhaja o sena mohala.

Sebopeho:Fexible PCB, High density PCB.

Lisebelisoa tsa Insulation:Epoxy Resin, Metal Composite Materials, Organic Resin.

Boitsebiso:Aluminium E Koahetseng Lera la Letlapa la Koporo, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber.

Theknoloji ea Ts'ebetso: Liehetsa Khatello Foil, Electrolytic Foil.

Nomoro ea Mohlala:XinDaChang-BC-008

Lebitso la Brand:Kopano ea XinDaChang PCB

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso ea Sehlahisoa:

Ntho NO	2 Orders 8 layers Ho qoelisoa Khauta OSP HDI PCBkopano
Lintho tse bonahalang	FR-4
Mekhahlelo	8 Mekhahlelo
Botenya ba ho qetela	0.70 limilimithara
Qetello ea Bokaholimo	Ho qoelisoa Khauta + OSP
Trace Width/ Sebaka sa ho Laela	Ka hare: 0.05mm/0.05mm Kantle: 0.05mm/0.05mm
Min Hole Size (um)	Ho Cheka Mechini: 0.2 limilimithara Ho cheka Laser: 0.1 limilimithara

Taolo ea Boleng

Boto e nepahetseng e phahameng, e sebelisetsoang lisebelisoa tsa bongaka2

a. 100％AOI,100％E-Teko,100％FQC + FQA
b. Mananeo a SPC le CPK
c. Lean Manufacturing le mananeo a 7S
d. Tlhahlobo e tsoetseng pele le lisebelisoa tsa laboratori
e. Tlaleho e tloaelehileng ea QA ka thomello e 'ngoe le e 'ngoe
f. Ho latela RoHS

Molemo oa Khoebo

Boto e phahameng ea ho nepahala, e sebelisetsoang lisebelisoa tsa bongaka

a. Setopo se le seng, mefuta e mengata e fapaneng, tlhahiso ea bongata, karabelo e potlakileng, e fihlela litlhoko tsa bareki ba fapaneng
Nehelano
a. Lifaele tsa Gerber
b. PCB parameters le litlhoko lakane
c. Bongata ba Tlhokahalo

Phano

Boto e nepahetseng e phahameng, e sebelisetsoang lisebelisoa tsa bongaka1

a. Bakeng sa sampole, nako ea thomello ke matsatsi a 15 a sebetsang.
b. Bakeng sa palo e nyane, nako ea ho fana e ka ba matsatsi a 30 a sebetsang.
c. Bakeng sa tlhahiso ea bongata, nako ea ho fana e ka ba matsatsi a 49 a sebetsang.
Matsatsi a khethehileng a ho fana a tla itšetleha ka maemo a sebele, empa re tla etsa sohle seo re ka se khonang ho tšehetsa le ho finyella litlhoko tsa hau.