FR4 Hdi habeli mahlakoreng a elektronike potoloho boto pcbs

Tlhaloso e Khutšoanyane:

Thepa e sa Lebelloang Lelakabe: V0, V1, V2

Lisebelisoa tsa Insulation: Epoxy Resin, Metal Composite Materials, Organic Resin

lintho tse bonahalang: Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, The Paper Ring Gas Resin

Mechanical e thata: E Fexible

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Litlhaloso tsa Bohlokoa/ Likarolo tse Khethehileng

Sebaka sa Tšimoloho: Chaena
Boitsebiso ba Motheo: FR-4
Botenya ba Koporo: 1/2OZ 1OZ 2OZ 3OZ
Botenya ba Boto: 0.8mm
Min. Boholo ba lesoba: 0.1mm
Min. Bophara ba Mola: 0.065mm
Min. Sebaka sa Mohala: 0.065mm
Qetello ea Bokaholimo: HASL
Kopo: Sesebelisoa sa Elektronike
Mofuta: Customizable
Mask ea solder: E ntšo
Boitsebiso: FR4 CEM1 CEM3 bophahamo TG
Mmala: Botala bo Bofubelu bo Botala bo Ntšo
Tšebeletso ea Teko: 100%
Matla a Phepelo: 25000 Square Meter/Square Meter ka Khoeli