Mollo alamo potoloho boto tsamaiso boto tloaelehileng tse ling tse pcb & pcba Featured Image

Mollo alamo potoloho boto tsamaiso boto tloaelehileng pcb tse ling & pcba

Tlhaloso e Khutšoanyane:

Feature:Ts'ehetso ea tloaelo

Layers:Habeli-Layer, Multilayer, One-Layer

Ho roala ka Metal:Silver, Tin

Mokhoa oa Tlhahiso:SMT

Mofuta:BMS PCBA, Puisano PCBA, Consumer electronics PCBA, Home appliance PCBA, LED PCBA, Motherboard PCBA, Smart electronics PCBA, Wireless tjhaja PCBA

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Litlhaloso tsa Bohlokoa/ Likarolo tse Khethehileng

Enke ea carbon e hatisoa holim'a PCB e le mokhanni oa ho hokahanya litsela tse peli ho PCB. Bakeng sa k'habone enke PCB, ea bohlokoa ka ho fetisisa ke boleng le ho hanyetsa ha oli ea carbon, ho sa le joalo, ho Immersion silevera PCB le Immersion tin PCB e ke ke ea hatisoa oli ea carbon, hobane ke Oxidizing.Ho sa le joalo, sebaka se fokolang sa mohala se lokela ho ba ho feta 0.2 mm. e le hore ho be bonolo ho etsa le ho laola ntle le potoloho e khutšoanyane.

Enke ea carbon e ka sebelisoa bakeng sa mabitso a keyboard, mabitso a LCD le li-jumpers. Khatiso e etsoa ka enke ea carbon conductive.

Lintho tsa carbon li tlameha ho hanela ho solder kapa HAL.
Li-insulation kapa bophara ba Carbon li kanna tsa se fokotse ka tlase ho 75% ea boleng bo ikhethileng.
Ka linako tse ling mask a khonang ho peel aa hlokahala ho itšireletsa khahlanong le li-fluxes tse sebelisitsoeng.

Mokhoa o Khethehileng oa Oli ea Carbon

Motho ea sebetsang o tlameha ho roala liatlana
2.Thepa e tlameha ho hloeka, bokaholimo bo se ke ba e-ba le lerōle, lithōle le lithōle tse ling
3.Lebelo la silika le ho khutlela taolong ea khatello ea khatello ea lebelo la enke sebakeng se setle ka ho fetisisa. (Ho ipapisitsoe le phello ea khatiso e le teko)
4.Screen stencil, scraper, litlhoko tse khethehileng tsa oli ea carbon ho latela litlhoko tsa boenjiniere MI
Oli ea 5.Carbon e tlameha ho tsoakana ka mokhoa o ts'oanang pele e sebelisoa, e nang le viscometer ho lemoha viscosity ka har'a mefuta e hlokahalang, enke e hloka ho koaloa ka nako ka mor'a ho qeta tšebeliso.
6.Pele ho hatisa, liboto tsohle li lokela ho hloekisoa poleiti ea mafura, oxide e litšila le litšila tse ling, lipoleiti tsohle tsa carbon plate li tlameha ho tiisoa ke QA pele ho tlhahiso ea molao.
7.Carbon board drying mocheso 150 ℃ nako 45 metsotso. Sekoti sa oli ea carbon Ho omisa mocheso 150 ℃ Nako metsotso e 20
8. Tekanyo ea ho hanyetsa oli ea carbon, boleng ba khanyetso ba oli ea carbon bo lokela ho ba ka tlaase ho 100 ohms, khanyetso ea mohala oa carbon e lokela ho ba ka tlaase ho 25Ω.
9.Ka mor'a ho lokolloa ho tloha ka ontong, mosebeletsi o lokela ho tsebisa QA ho hlahloba khanyetso ea carbon le ho etsa tlhahlobo ea ho khomarela.
10. Mofuta o mong le o mong oa skrine sa carbon oil o sebelisa max 2500 prints, o tlameha ho khutlisetsoa kamoreng ea marang-rang ho omisa mofuta o mocha ha ho fihla makhetlo a 2500.

Re lumela hore Carbon oil PCBA e fana ka motsoako o ke keng oa qojoa oa boleng, ts'ebetso le boleng. Haeba u na le lipotso mabapi le sehlahisoa sena kapa u lakatsa ho ithuta haholoanyane ka hore na se ka tsoela khoebo ea hau molemo joang, ka kopo u seke oa tsilatsila ho ikopanya le rona. Re ikemiselitse ho fana ka litšebeletso tse ntle tsa bareki le ho thusa bareki ba rona ho fihlela sepheo sa bona sa khoebo.

Kea leboha ha u nahana ka oli ea Carbon PCBA. Re labalabela monyetla oa ho sebetsa le uena le ho u thusa ho fihlela katleho.

Lihlahisoa tsa lihlahisoa

Ntho	Tlhaloso
Lintho tse bonahalang	FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminium Base, Copper Base,Ceramic, Crockery, joalo-joalo.
Litlhaloso	Tg CCL e Phahameng ea Fumaneha(Tg>=170℃)
Qetella Botenya ba Boto	0.2 mm-6.00mm(8mil-126mil)
Surface Finish	Monoana oa khauta(>=0.13um), Khauta e Kentsoeng(0.025-0075um), Khauta ea Plating(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Sebopeho	Ho tsamaisa tsela,Tebela,V-cut,Chamfer
Phekolo ea Bokaholimo	Solder Mask (e ntšo, e tala, e tšoeu, e khubelu, e putsoa, botenya> = 12um, Block, BGA)
	Silkscreen (e ntšo, e mosehla, e tšoeu)
	Mask e khonang ea peel (e khubelu, e putsoa, botenya> = 300um)
Bonyane Core	0.075mm(3mil)
Botenya ba Koporo	1/2 oz min; 12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter bakeng sa ho Drilling ea CNC	0.1mm(4mil)
Min Hole Diameter bakeng sa ho phunya	0.6mm(35mil)
Boholo bo boholo ba phanele	610mm * 508mm
Boemo ba lesoba	+/-0.075mm(3mil) CNC Drilling
Bophara ba Mokhanni(W)	+/-0.05mm(2mil) kapa +/-20% ea mantlha
Hole Diameter(H)	PTHL:+/-0.075mm(3mil)
	E seng PTHL:+/-0.05mm(2mil)
Hlalosa Mamello	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Khanyetso ea Insulation	10Kohm-20Mohm
Boikhantšo	<50 ohm
Teko ea Voltage	10-300V
Boholo ba Panel	110 x 100mm(mets)
	660 x 600mm(boholo)
Ngoliso e fosahetseng ea lera	4 mealo:0.15mm(6mil)max
	6 mealo:0.25mm(10mil)max
Sebaka se senyenyane pakeng tsa sekoti ho ea ho paterone ea potoloho ea lera le ka hare	0.25mm(10mil)
Sebaka se senyenyane pakeng tsa boto le paterone ea potoloho ea lera le ka hare	0.25mm(10mil)
Mamello ea botenya ba boto	4 mekhahlelo:+/-0.13mm(5mil)

Melemo ea Rōna

1) Bokhoni bo Ikemetseng ba R&D - Sehlopha sa rona sa lienjineri tse nang le boiphihlelo ba software le hardware li ka rala le ho nts'etsapele mapolanka a tloaelo a elektroniki ho lekana litlhoko tsa hau tse ikhethileng.
2) Ts'ebeletso e le 'ngoe - Mehala ea rona ea 8 ea lebelo le holimo le e 12 ea tlhahiso ea mochini o behang ka lebelo le holimo, hammoho le mela e 4 ea tlhahiso ea li-plug-in le liphaephe tse 3, e fana ka ts'ebetso e se nang moeli, e felletseng ea tlhahiso bakeng sa bareki bohle ba rona.

3) Karabelo e potlakileng - Re etelletsa pele khotsofalo ea bareki mme re ikemiselitse ho fana ka ts'ebeletso e potlakileng, e sebetsang ho fihlela litlhoko tsohle tsa hau.

E fetileng: Lihlahisoa tsa elektronike OEM ODM PCB Kopano ditshebeletso

E 'ngoe: Firmware Decode PCB Copy PCB Clone PCB software e nts'etsapele PCBA Reversing Engineering Service

Ngola molaetsa wa hao mona mme o re romele wona