| Mekhahlelo | 1-2 Mekhahlelo |
| Botenya bo Feletseng | 16-134mil (0.4mm-3.4mm) |
| Max. Boemo | 500mm *1200mm |
| Botenya ba Koporo | 35um, 70um, 1 ho ea ho 10oZ |
| Min Line Width/Space | 4mil (0.1mm) |
| Min E Felletse Hole Size | 0.95 limilimithara |
| Min. Size ea ho cheka | 1.00mm |
| Max. Size ea ho cheka | 6.5 limilimithara |
| Mamello e Felletseng ea Hole Size | ± 0.050mm |
| Aperture Position Precision | ± 0.076 limilimithara |
| Min SMT PAD Size | 0.4mm±0.1mm |
| Min.Solder Mask PAD | 0.05mm(2mil) |
| Min.Solder Mask Cover | 0.05mm(2mil) |
| Solder mask Botenya | > 12um |
| Qetello ea Bokaholimo | HAL, HAL Lead ea mahala,OSP, Khauta e Kentsoeng, joalo-joalo |
| HAL Botenya | 5-12um |
| Ho Inela Botenya ba Khauta | 1-3 mil |
| Botenya ba lifilimi tsa OSP | ENTEK PLUS HT: 0.3-0.5um; F2:0.15-0.3um |
| Ho Qetella ha Outline | Routing & Punching; Phapang e nepahetseng ± 0.10mm |
| Thermal Conductivity | 1.0 ho isa ho 12w/mk |
| Boema-kepe ba FOB | Shenzhen |
| Thepa Likhathone tsa Thepa L/W/H | 36 x 26 x 25 Disentimitara |
| Lead time | 3-7 matsatsi |
| Diyuniti ho ya ka Lebokose la Thomello | 5.0 |
| Export Carton Weight | 18 lik'hilograma |