Mekhahlelo | 1-2 Mekhahlelo |
Botenya bo Feletseng | 16-134mil (0.4mm-3.4mm) |
Max. Boemo | 500mm *1200mm |
Botenya ba Koporo | 35um, 70um, 1 ho ea ho 10oZ |
Min Line Width/Space | 4mil (0.1mm) |
Min E Felletse Hole Size | 0.95 limilimithara |
Min. Size ea ho cheka | 1.00mm |
Max. Size ea ho cheka | 6.5 limilimithara |
Mamello e Felletseng ea Hole Size | ± 0.050mm |
Aperture Position Precision | ± 0.076 limilimithara |
Min SMT PAD Size | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm(2mil) |
Min.Solder Mask Cover | 0.05mm(2mil) |
Solder mask Botenya | > 12um |
Qetello ea Bokaholimo | HAL, HAL Lead ea mahala,OSP, Khauta e Kentsoeng, joalo-joalo |
HAL Botenya | 5-12um |
Ho Inela Botenya ba Khauta | 1-3 mil |
Botenya ba lifilimi tsa OSP | ENTEK PLUS HT: 0.3-0.5um; F2:0.15-0.3um |
Ho Qetella ha Outline | Routing & Punching; Phapang e nepahetseng ± 0.10mm |
Thermal Conductivity | 1.0 ho isa ho 12w/mk |
Boema-kepe ba FOB | Shenzhen |
Thepa Likhathone tsa Thepa L/W/H | 36 x 26 x 25 Disentimitara |
Lead time | 3-7 matsatsi |
Diyuniti ho ya ka Lebokose la Thomello | 5.0 |
Export Carton Weight | 18 lik'hilograma |