Ho tjhaja koloi qubu motherboard control board SMT chip process

Koloi tjhaja qubu motherboard taolo boto SMT chip sebetsa PCBA ho tjhaja qubu tharollo potoloho boto moetsi

Tlhaloso e Khutšoanyane:

Koloi e tjhajang qubu ea PCBA motherboard ke karolo ea mantlha e sebelisoang ho laola qubu ea ho tjhaja.
E na le mesebetsi e fapaneng. Mona ke kenyelletso e khuts'oane ea likarolo tsa eona tsa mantlha:
Matla a ho sebetsa ka matla: PCBA motherboard e na le microprocessor e sebetsang hantle haholo, e ka sebetsanang ka potlako le mesebetsi e sa tšoaneng ea ho laola le ho netefatsa polokeho le botsitso ba ts'ebetso ea ho tjhaja.
Moralo o ruileng oa segokanyimmediamentsi sa sebolokigolo: PCBA motherboard e fana ka mefuta e fapaneng ea li-interfaces, tse kang li-interfaces tsa matla, li-interfaces tsa puisano, joalo-joalo, tse ka finyellang litlhoko tsa phetisetso ea data le litlhoko tsa ho sebelisana le lipontšo pakeng tsa ho tjhaja qubu, likoloi le lisebelisoa tse ling.
Taolo e bohlale ea ho tjhaja: PCBA motherboard e ka laola ka bohlale ho tjhaja hajwale le voltage ho ya ka boemo ba matla a betri le ditlhoko tsa ho tjhaja ho qoba ho tjhaja betri ho feta tekano kapa ho tjhaja ka tlase, ho lelefatsa bophelo ba betri ka katleho.
Ts'ireletso e felletseng ea ts'ireletso: PCBA motherboard e kopanya mesebetsi e fapaneng ea ts'ireletso, joalo ka ts'ireletso e fetelletseng, ts'ireletso e feteletseng, ts'ireletso e tlase-voltage, joalo-joalo, e ka felisang phepelo ea motlakase ka nako ha maemo a sa tloaelehang a etsahala ho netefatsa hore ts'ebetso e tloaelehileng ea sistimi. Tšireletseho ea ts'ebetso ea ho tjhaja.
Ho boloka matla le ts'ireletso ea tikoloho: PCBA motherboard e amohela moralo o bolokang matla, o ka fetolang matla a hona joale le motlakase ho latela litlhoko tsa sebele, ho fokotsa tšebeliso ea matla ka katleho le ho fokotsa tšusumetso tikolohong.
Ho bonolo ho boloka le ho ntlafatsa: PCBA motherboard e na le scalability e ntle le ho lumellana, e leng ho nolofalletsang tlhokomelo le ho ntlafatsa hamorao, 'me e ka ikamahanya le liphetoho tsa mefuta e fapaneng le litlhoko tse fapaneng tsa ho tjhaja.
.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Pontšo ea bokhoni ba ts'ebetso:
1. Botenya ba poleiti:
0.3MM ~ 3.0MM (bonyane 0.15mm, botenya bo boholo bo ka etsoa ho latela litlhoko tsa bareki)
2. Enke:
Oli e tala, oli e putsoa, oli e ntšo, oli e tšoeu, oli e khubelu ea botoro, pherese, matte e ntšo
3. Theknoloji ea holim'a metsi: Anti-oxidation (SOP), spray ea tin e nang le loto, sefafatsi sa thini se se nang loto, khauta e qoelisoang, ho penta ka khauta, ho pata ha silevera, ho pata nickel, monoana oa khauta,koloioli ea bohlokoa
4. Theknoloji e khethehileng: boto ea impedance, boto e phahameng ea maqhubu, boto ea lesoba le patiloeng (bonyane ba lesoba la 0.1mm laser hole)

Mohlala: o hlophisitsoeng
Palo ea lihlahisoa tsa lihlahisoa: li-multi-layer
Insulating material: organic resin
Ts'ebetso e thibelang malakabe: Boto ea VO
Lintho tse matlafatsang: motheo oa lesela la fiberglass
Ho tiea ha mochini: ho thata
Boitsebiso: koporo
Insulation layer botenya: poleiti e tšesaane
Theknoloji ea ho sebetsa: Foil ea khalendara
Insulating resin: polyimide resin (PI)
Palo ea mekhahlelo ea tlhahiso: 1 ~ 10 layers
Boholo bo boholo: 600X600mm
Bonyane boholo: ± 0.15mm
Mamello ea Layman: 0.4 ~ 3.2mm
Tlhaloso ea botenya ba poleiti: ± 10%
Bophara ba moeli oa boto: 5MIL (0.127mm)
Sebaka sa moeli oa boto: 5MIL (0.127mm)
Botenya ba koporo bo felileng: 1OZ (35UM)
Ho cheka ka mechine: 0.25 ~ 6.3mm
Aperture mamello: ± 0.075mm
Bonyane tlhaku: bophara ≥ 0.15mm/bophahamo ≥ 0.85n
Sebaka ho tloha moleng ho ea ho kemiso: ≥12MIL (0.3mm)
Mofuta oa mask oa solder: enke e nkang lifoto / enke ea matte
Ha ho sebaka sa sebaka: Omm
Sebaka sa phanele: 1.5mm
Ts'ebeletso e le 'ngoe ea PCBA, ho tsamaisoa ka potlako.